Power chips are connected to outside circuits via product packaging, and their efficiency depends on the support of the product packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation describes the electric link on the upper surface area of the chip, which is normally light weight aluminum bonding cable in typical modules. ^
Typical power component package cross-section
Presently, business silicon carbide power components still mainly use the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They encounter troubles such as large high-frequency parasitic specifications, not enough warmth dissipation capacity, low-temperature resistance, and not enough insulation strength, which limit using silicon carbide semiconductors. The display screen of excellent efficiency. In order to resolve these problems and fully exploit the massive potential benefits of silicon carbide chips, many new product packaging technologies and services for silicon carbide power modules have actually emerged over the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold cable bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold cords to copper cables, and the driving pressure is expense decrease; high-power tools have established from light weight aluminum cables (strips) to Cu Clips, and the driving force is to enhance product efficiency. The greater the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with conventional bonding packaging techniques, Cu Clip innovation has the following advantages:
1. The link between the chip and the pins is made of copper sheets, which, to a specific extent, changes the basic wire bonding method in between the chip and the pins. For that reason, a distinct package resistance worth, greater existing circulation, and far better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can fully conserve the cost of silver plating and inadequate silver plating.
3. The item appearance is entirely regular with normal products and is mainly used in web servers, mobile computers, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding method is much more costly and intricate, yet it can achieve much better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad uses a Clip method, and the Gate makes use of a Cable method. This bonding method is slightly cheaper than the all-copper bonding method, conserving wafer area (relevant to very little gate areas). The procedure is easier than the all-copper bonding approach and can get much better Rdson and much better thermal impact.
Vendor of Copper Strip
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